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发布日期:2021年10月27日
圆片级与扇出封装技术
圆片级与扇出封装技术

JCET offers wafer level technologies forthe following package options:

• eWLB (embedded Wafer Level Ball Grid Array)
• eWLCSP (encapsulated Wafer Level Chip Scale Packages)
• WLCSP (Wafer Level Chip Scale Packages)
• IPD (Integrated Passive Devices)
• ECP (Encapsulated Chip Package)
• RFID (Radio Frequency Identification)

Today’s consumers are looking for powerful,multi-functional electronic devices with unprecedented performance and speed,yet small, then and low cost.  Thiscreates complex technology and manufacturing challenges for semiconductorcompanies as they look for new ways to achieve greater performance andfunctionality in a small, then, low cost device.  JCET is an industry leader in providing acomprehensive platform of wafer level technology solutions including Fan-inWafer Level Packaging (FIWLP), Fan-out Wafer Level Packaging (FOWLP), IntegratedPassive Devices (IPD), Through Silicon Via (TSV), Encapsulated Chip Package (ECP), and RadioFrequency Identification (RFID).

BreakthroughFlexLineTM Manufacturing Approach

19韩国女主播vip秀1368 最新版app下载 免费观看,人妻献身系列在线阅读 v2 1 1版下载Our innovative approach to wafer levelmanufacturing, known as the FlexLineTM method, provides customers freedom fromwafer diameter constraints, while enabling supply chain simplification andsignificant cost reductions that are not possible with a conventionalmanufacturing flow.  This FlexLinemanufacturing method is a significant paradigm shift from conventional waferlevel manufacturing, and delivers an unmatched level of flexibility and costsavings for both Fan-In and Fan-Out wafer level packaging.


The FlexLine approach provides freedom fromwafer diameter constraints while enabling supply chain simplification andsignificant cost reductions not possible with conventional wafer levelmanufacturing. 19韩国女主播vip秀1368 最新版app下载 免费观看,人妻献身系列在线阅读 v2 1 1版下载

VersatileTechnology Platform for 2.5D and 3D Integration

The FlexLine approach provides freedom fromwafer diameter constraints while enabling supply chain simplification andsignificant cost reductions not possible with conventional wafer levelmanufacturing.

• Higher performance
• Higher bandwidth
• Higher frequencies
• Thinner package profiles
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